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From July 5, 2021, customs requirements code “Z” for 8486.10.00.20-1 “Grinding, polishing and lapping machines for processing of semiconductor wafers” and 17 other commodities are added to the Import and Export Commodity Classification of the Republic of China. Please be aware of the changes when declaring.

From July 5, 2021, customs requirements code “Z” for 8486.10.00.20-1 “Grinding, polishing and lapping machines for processing of semiconductor wafers” and 17 other commodities are added to the Import and Export Commodity Classification of the Republic of China. Please be aware of the changes when declaring.

Issued:Secretariat Release date:2021-07-12 Click times:55